Chinese Automotive-Grade Chips Make Major Strides, Breaking Technical Barriers Across Key Domains

Release date:2025-12-29 Number of clicks:160

In a significant push for automotive semiconductor independence, several leading Chinese chip design companies have announced major breakthroughs across multiple critical vehicle domains. Firms including Autochips, RuiFaKe, Naxes Micro, Silergy, and Gateland are introducing advanced, certified products for smart cockpits, in-vehicle displays, safety systems, powertrain management, and connectivity, aiming to strengthen the domestic automotive supply chain.

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Key Product Announcements and Certifications

  • Autochips AC8025: A new-generation smart cockpit domain controller featuring an integrated high-performance NPU for AI tasks. It supports up to 7 in-vehicle displays and has obtained both AEC-Q100 Grade 1 quality certification and ISO 26262 ASIL-B functional safety compliance.

  • RuiFaKe SerDes Chipset (NS6168 & NS6129S): Designed for high-speed in-vehicle displays, this chipset complies with China's domestic HSMT standard. It meets AEC-Q100 Grade 2 and ISO 26262 ASIL-B standards for reliability and safety in wide temperature ranges.

  • Naxes Micro NSM41xx Series: An AMR-based wheel speed sensor series for ABS/ESP systems. The chips are developed according to ISO 26262 ASIL B(D) and have passed over 30 stringent EMC tests from a major automaker.

  • Silergy SA63122: A landmark 18-cell Battery Management System (BMS) AFE chip. It is reportedly China's first 18-cell AFE to achieve ISO 26262 ASIL-D certification from the China Automotive Technology and Research Center (CATARC) and meets AEC-Q100 Grade 1.

  • Gateland Dubhe Series: A UWB SoC series enabling digital car keys and kick-sensing applications. These chips support advanced configurations like 2TX/4RX for precise localization.

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ICgoodFind's Insight
This concerted wave of product launches from Chinese chipmakers, all backed by rigorous international automotive certifications (AEC-Q100, ISO 26262), signals a maturing domestic ecosystem. It demonstrates a strategic move from basic component supply to developing complex, safety-critical semiconductors essential for next-generation electric and intelligent vehicles.

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