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GigaDevice – A Leader in China’s Memory Chip Industry: Complete Guide to Its Chip Series

Release date：2025-12-10 Number of clicks：80

GigaDevice (Beijing GigaDevice Semiconductor Inc.)

GigaDevice (Beijing GigaDevice Semiconductor Inc.) is a leading Fabless semiconductor design company in China, mainly manufacturing the following major categories of chip products:

1. Memory Chips (Core Product Line)

NOR Flash

  • SPI NOR Flash: GD25/GD55 series, with cumulative global shipments exceeding 23.7 billion units, ranking second in the global market.
  • High-performance NOR Flash: GD25LX series, with a data throughput rate of up to 400MB/s, designed specifically for high-speed code execution.

NAND Flash

  • SPI NAND Flash: GD5F series, the latest 24nm process products (e.g., GD5F1GM7).
  • Automotive-grade NAND: Cumulative shipments exceeding 200 million units, certified to AEC-Q100.

Specialty DRAM

  • DDR3L/DDR4 products, applied in network communication, smart TVs, industrial control, and other fields.

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2. Microcontroller (MCU) Chips (Second Core Business)

GD32 Series

The top brand in China’s 32-bit general-purpose MCU market, with cumulative shipments exceeding 1.98 billion units.

By Core Type

  • Arm Cortex-M Series:
    • M33 core: GD32G5 series (216MHz main frequency), awarded the 2025 Global Electronics Achievement Award for "MCU of the Year".
    • M7 core: High-performance series, suitable for industrial automation and motor control.
    • M4/M23/M0+ and other series, meeting diverse performance requirements.
  • RISC-V Core: GD32V series, domestically independent instruction set MCUs.

Specialized MCUs

  • Fingerprint Recognition-specific: Synergized with the company’s sensor business.
  • Industry-specific series: For optical modules, printers, etc.
  • Automotive-grade MCU: GD32A503 series, used in automotive motor control, BMS, and other systems.

3. Intelligent Human-Machine Interaction Sensor Chips

Touch Chips

  • Self-capacitive and mutual-capacitive touch solutions, applied in smartphones, tablets, and smart homes.

Fingerprint Recognition Chips

  • Ranked second in the domestic market, providing high-security biometric recognition solutions.

4. Analog Chips and Solutions

Power Management

  • Linear Regulators (LDO), DC-DC converters, etc.
  • High-voltage analog chips (24V/48V), used in industrial and automotive applications.

Motor Drivers

  • GD30DR series: Brushed/brushless motor driver chips, adapted for humanoid robot joints and industrial automation.
  • Stepper motor driver chips, enabling precise control applications.

Signal Chain

  • ADC (Analog-to-Digital Converter): GD30AD series.
  • Operational Amplifiers: GD30AP series.
  • Comparators: GD30CP series.
  • Temperature Sensors: GD30TS series.

5. System-on-Chip (SOC) Solutions

High-performance Integrated Chips

  • GD30DRE508 series: SOC chips integrating drive and control functions, designed specifically for robot joints.
  • Integrated solutions combining power management + MCU + communication interfaces, applied in IoT devices and consumer electronics.

Product Application Fields

Chip Category Main Application Scenarios
NOR Flash Code storage, firmware upgrade, industrial control, automotive electronics
MCU Industrial automation, smart home, consumer electronics, automotive electronics, humanoid robots, medical equipment
Sensors Mobile terminals, PCs, biometric recognition, IoT devices
Analog Chips Power management, motor control, industrial automation, automotive electronics

Industry Position

  • NOR Flash: Second in the global market, after Macronix.
  • MCU: First in China’s 32-bit general-purpose MCU market, a benchmark for domestic substitution.
  • Automotive-grade Chips: Certified to AEC-Q100, with cumulative shipments exceeding 200 million units, entering mainstream automotive supply chains.

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Common Material Models for Engineers’ Hardware Selection

GDQ Series - DDR4 Memory

Chip Model Package Type
GDQ3BFAM-CJ 96-FBGA
GDQ3A8AM-WI 78-FBGA
GDQ2BFAA-WQ 96-FBGA
GDQ2BFAA-CQ 96-FBGA

GD5F Series - NAND Flash

Chip Model Package Type
GD5F2GQ5UEYIGR WSON-8-EP(6x8)
GD5F2GM7UEYIGR WSON-8(8x6mm)
GD5F1GQ5UEYIGR WSON-8(8x6mm)
GD5F1GQ5UEYIG WSON-8(8x6mm)
GD5F1GQ5REYIGR WSON-8(8x6mm)
GD5F1GQ4UBYIGR WSON-8(8x6mm)
GD5F1GQ4UBYIG WSON-8(8x6mm)
GD5F1GM7UEYIGR WSON-8(8x6mm)

GD32 Series - MCU

Chip Model Package Type
GD32F470ZIT6 LQFP-144(20x20mm)
GD32F470VGT6 LQFP-100(14x14mm)
GD32F450VET6 LQFP-100(14x14mm)
GD32F450IKH6 LQFP-144(20x20mm)
GD32F4501IH6 LQFP-144(20x20mm)
GD32F427ZET6 LQFP-144(20x20mm)
GD32F427VET6 LQFP-100(14x14mm)
GD32F427RET6 LQFP-64(10x10mm)
GD32F407ZGT6 LQFP-144(20x20mm)
GD32F407VGT6 LQFP-100(14x14mm)
GD32F407VET6 LQFP-100(14x14mm)
GD32F407RET6 LQFP-64(10x10mm)
GD32F405RGT6 LQFP-64(10x10mm)
GD32F405RET6 LQFP-64(10x10mm)
GD32F330K8U6 TSSOP-20
GD32F330CBT6 LQFP-48(7x7mm)
GD32F307VCT6 LQFP-100(14x14mm)
GD32F307RCT6 LQFP-64(10x10mm)
GD32F305VET6 LQFP-100(14x14mm)
GD32F305RBT6 LQFP-64(10x10mm)
GD32F303ZET6 LQFP-144(20x20mm)
GD32F303VGT6 LQFP-100(14x14mm)
GD32F303VET6 LQFP-100(14x14mm)
GD32F303VCT6 LQFP-100(14x14mm)
GD32F303RGT6 LQFP-64(10x10mm)
GD32F303RET6 LQFP-64(10x10mm)
GD32F303RCT6 LQFP-64(10x10mm)
GD32F303CGT6 LQFP-48(7x7mm)
GD32F303CET6 LQFP-48(7x7mm)
GD32F303CCT6 LQFP-48(7x7mm)
GD32F303CBT6 LQFP-48(7x7mm)
GD32F130G8U6TR TSSOP-20
GD32F130F8P6TR TSSOP-20
GD32F130C8T6 LQFP-48(7x7mm)
GD32F105VCT6 LQFP-100(14x14mm)
GD32F105RCT6 LQFP-64(10x10mm)
GD32F105RBT6 LQFP-64(10x10mm)
GD32F103ZET6 LQFP-144(20x20mm)
GD32F103VGT6 LQFP-100(14x14mm)
GD32F103VET6 LQFP-100(14x14mm)
GD32F103VCT6 LQFP-100(14x14mm)
GD32F103TBU6 TSSOP-20
GD32F103RET6 LQFP-64(10x10mm)
GD32F103RCT6 LQFP-64(10x10mm)
GD32F103RBT6 LQFP-64(10x10mm)
GD32F103CBT6 LQFP-48(7x7mm)
GD32F103C8T6 LQFP-48(7x7mm)
GD32E230K8T6 LQFP-48(7x7mm)
GD32E230C8T6 LQFP-48(7x7mm)
GD32E103RBT6 LQFP-64(10x10mm)
GD32E103CBT6 LQFP-48(7x7mm)
GD32C103RBT6 LQFP-64(10x10mm)
GD32C103CBT6 LQFP-48(7x7mm)

GD25 Series - NOR Flash

Chip Model Package Type
GD25Q80ETIGR SOP-8
GD25Q80ETIG SOP-8
GD25Q80EEIGR SOP-8
GD25Q80CSIG USON-8
GD25Q80CEIGR SOP-8
GD25Q64ESIG SOP-8
GD25Q64CSIGR USON-8
GD25Q64CSIG USON-8
GD25Q40CTIGR SOP-8
GD25Q40CTIG SOP-8
GD25Q40CEIGR SOP-8
GD25Q32EWIGR SOP-8
GD25Q32EWIG SOP-8
GD25Q32ESIGR SOP-8
GD25Q32ESIG SOP-8
GD25Q32CSIGR USON-8
GD25Q32CSIG USON-8
GD25Q256EYIGR SOP-8
GD25Q256DYIGR SOP-8
GD25Q16ETIGR SOP-8
GD25Q16ESIGR SOP-8
GD25Q16ESIG SOP-8
GD25Q16CTIGR SOP-8
GD25Q16CSIGR USON-8
GD25Q16CSIG USON-8
GD25Q128EWIGR SOP-8
GD25Q128ESIG SOP-8
GD25Q127CSIGR USON-8
GD25Q127CSIG USON-8
GD25LQ128EWIGR SOP-8
GD25LQ128ESIGR SOP-8
GD25LQ128DSIGR SOP-8
GD25LQ128DSIG SOP-8

Package Type Explanation

FBGA - Fine-Pitch Ball Grid Array

Used for high-performance memory:

  • 78-FBGA: 78 solder balls, suitable for x8 architecture DDR4.
  • 96-FBGA: 96 solder balls, suitable for x16 architecture DDR4.

WSON-8 - Wide-body Wafer-Level Chip Scale Package (8 pins)

  • Common sizes: 8x6mm or 6x5mm, with exposed pad (EP).
  • Used for SPI NAND Flash; 8 pins include VCC, GND, and data interfaces.

LQFP - Low-profile Quad Flat Package

  • Numbers indicate pin count (e.g., LQFP-144 = 144 pins).
  • Common sizes: 20x20mm (144pin), 14x14mm (100pin), 10x10mm (64pin), 7x7mm (48pin).

TSSOP - Thin Shrink Small Outline Package

  • Suitable for small-package MCUs (e.g., GD32F130 series).

SOP-8/USON-8 - Small Outline Package/Ultra-Small Outline No-Lead Package (8 pins)

  • Used for SPI NOR Flash; 8 pins include SCLK, CS#, I/O0-3, etc.

Summary

  • GDQ Series (DDR4): Mainly use FBGA packages (78 or 96 balls).
  • GD5F Series (NAND Flash): Mainly use WSON-8 packages (8x6mm).
  • GD32 Series (MCU): Mainly use LQFP packages (144/100/64/48 pins based on model).
  • GD25 Series (NOR Flash): Mainly use SOP-8 or USON-8 packages.

GigaDevice’s product layout centers on the four core technology platforms of "Memory + MCU + Sensors + Analog", forming a complete industrial chain from chip design to system solutions. Its products are widely applied in consumer electronics, industrial control, automotive electronics, medical equipment, AIoT, and other fields, making it a leading enterprise in China’s semiconductor design industry.

#GigaDevice #Semiconductor Supply Chain #Chip Distributor #Chip Agent #Chip Business #ICGOODFIND

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